The latest blog from Zuken reports on the company events in both Ulm and Hanover. Although the title of the blog calls the events "German Engineering Days 2012" this is really wishful thinking on the part of the author since the events took place at the end of October 2011. The blog does include a notice of the dates for next year that are worth remembering. The Ulm event will take place October 23-24, 2012 and the Hanover get together is scheduled for November 6-7 2012.

Designers working on subsystems and systems using information for LED, semiconductor, and package components use complex thermal analysis software to help accelerate the design of their products but the analysis, typically based on vendor datasheets, often provides insufficient results. Clear, accessible, and reliable data relating to thermal characteristics upstream and downstream is critical. Methods to achieve this have traditionally been awkward, manual and therefore error-prone.

IC design has captured the glamour of electronic design for at least the last twenty five years, yet IC's are useless without a sound system design that includes not only PC Boards, but also the cabling that connect the electronic part to the rest of the system.

Attendees at next week Z-DAC annual conference in San Antonio will get to see the newest product from Zuken called Design Force. The new tool enables single board, multi-board, and chip-package-board interconnect optimization in native 3D. Design Force is a single solution environment which includes embedded interactive and automatic routing, design analysis and constraint management.