Last Week Today, October 16, 2017

Submitted by Gabe Moretti on Sun, 10/15/2017 - 23:19

Synopsys, Inc. announced the release of version 2017.09 of the Synopsys RSoft™ product portfolio.

RSoft Photonic Component Design Suite New features include:

  • S-Matrix/PDK Generation Utility to automate the interface between RSoft component tools, the RSoft OptSim Circuit tool, and mask layout tools. The utility creates the S-Matrix of a photonic component using the RSoft FullWAVE™, BeamPROP™ and ModePROP™ tools and exports it to OptSim™ Circuit to verify its performance in a photonic integrated circuit (PIC) or system. The final design can then be easily exported to mask layout tools to create an optical process design kit (PDK). The interface allows designers to efficiently create PICs from basic building elements and accurately test PIC performance prior to fabrication.
  • Expanded effective index method (EIM) implementation in RSoft component tools. EIM is a sophisticated method for reducing 3D waveguide structures, such as silicon photonics components, into equivalent 2D structures for extremely fast and accurate performance simulations. EIM can increase simulation speeds by 100x or more.
  • Improved RSoft FullWAVE pulsed and broadband simulation. This feature allows engineers to accurately simulate the spectral response of photonic devices over a wide wavelength―or spectral―range with just a single simulation. It is especially useful for analyzing resonant devices such as ring resonators.
  • Expanded documentation and examples demonstrate how the RSoft tools' proprietary sub-cell meshing capabilities can significantly improve the accuracy and speed of photonic component simulations.

RSoft Photonic System Design Suite New features include:

  • Interface between the RSoft OptSim and OptSim Circuit tools and Synopsys' HSPICE simulator for seamless optoelectronic analysis. With more than 25 years of successful design tapeouts, the HSPICE tool is the industry's gold-standard electrical circuit simulator and offers foundry-certified electrical MOS device models. The RSoft-HSPICE interface supports precise co-simulation of electronic components in photonic circuits in both on-chip and off-chip optical configurations. RSoft OptSim and OptSim Circuit are the only photonic simulation tools on the market that offer this capability.
  • Updated PDKs including the American Institute for Manufacturing Integrated Photonics (AIM Photonics) PDK version 1.5b and imec PDK version ISIPP50G. The PDKs help reduce PIC design costs and bring designers a step closer to fabrication through facilities supporting the AIM and imec processes.
  • Support for PhoeniX Software's OptoDesigner elastic connectors. Constraints from packaging and design rule checks can impose restrictive routing requirements on schematic-driven layouts. To overcome these constraints, OptSim Circuit supports OptoDesigner elastic connectors, where the shape and dimensions of the connectors are determined through tight integration with layout generation, and equivalent compact models for these connectors are created and simulated in OptSim Circuit.
  • Addition of the Viterbi and Viterbi (V & V) Mth power Carrier Phase Estimation algorithm in the OptSim digital signal processing (DSP) library for MATLAB. Accurate estimation of the optical carrier in phase-modulated coherent fiber-optic transmission systems is a vital responsibility of DSP at the receiver. As the order of modulation increases, susceptibility to laser phase noise requires accurate methods for phase estimation. The V & V Mth power algorithm in the OptSim tool helps designers achieve accurate estimation of carrier phase for QPSK and PM-QPSK modulation formats.

TDK Corporation presents new miniaturized EPCOS MEMS pressure sensor dies. The automotive versions of the C33 series boast dimensions of just 1 mm x 1 mm x 0.4 mm, making them one of the smallest of their kind. They are designed for absolute pressures of 1.2 bar to 10 bar, and are qualified based on AEC-Q101. The C39 type, with its footprint of just 0.65 mm x 0.65 mm is especially suitable for IoT and consumer applications. One noteworthy feature of the C39 is its low insertion height of just 0.24 mm, which makes the low-profile MEMS pressure sensor die ideal for applications in smartphones and wearables, for example, where space requirements are critical.

Addressing the growing industry need to use embedded FPGA technology to design chips and MCUs, Flex Logix Technologies, Inc., announced that Sandia National Laboratories has licensed its EFLX reconfigurable logic IP. As part of their licensing agreement, Flex Logix has delivered the Gen 2 EFLX-2.5K logic core in Sandia’s proprietary 180nm process for the development of multiple Sandia chip products for use in Sandia projects.

NI AWR Design Environment has added process design kit (PDK) support for ON Semiconductor’s integrated passive devices (IPDs) process. Developed in conjunction with NI AWR software experts, the ON Semiconductor IPD PDK is ideal for fabrication of passive devices such as baluns, filters, couplers, diplexers and matching networks that are used in portable, wireless and RF applications. Implemented in the PDK are electrical models and layout parameterized cells (PCells) that support Microwave Office extraction flow for AXIEM 3D planar electromagnetic (EM) simulation. The PDK also incorporates iNet™ technology for intelligent and automated net routing, design-rule checking (DRC) and connectivity checker/highlighter.

 

Magewell has introduced two dual-channel 4K models in its popular Pro Capture family of PCI Express capture hardware. Unlike competing multi-channel offerings that limit 4K capture frame rates to just 30 frames per second, the new dual-channel Pro Capture 4K cards support video resolutions up to 4096x2160 at full 60fps over high-speed PCIe 3.0 x4 bus interfaces. The Pro Capture Dual HDMI 4K Plus features HDMI 2.0 inputs, while the Pro Capture Dual SDI 4K Plus flexibly supports single-link 12G-SDI, dual-link 6G-SDI or quad-link 3G-SDI connectivity.

 

Further differentiating the dual-channel 4K Pro Capture models from competitors, both inputs can be used simultaneously with independent resolutions, frame rates and processing settings. Each source channel can also be routed to multiple software applications in parallel, again with varying capture parameters for each program.

 

GLOBALFOUNDRIES unveiled AutoPro, a new platform designed to provide automotive customers a broad set of technology solutions and manufacturing services that minimize certification efforts and speed time-to-market. The company offers the industry’s broadest set of solutions for a full range of driving system applications, from informational Advanced Driver Assistance Systems (ADAS) to high-performance real-time processors for autonomous cars.

 

Today, the automobile semiconductor market is approximately $35 billion, and is expected to grow to an estimated $54 billion by 2023. This is driven by a need for new technologies that promise to enhance the driving experience such as navigation, remote roadside assistance and advanced systems that combine data from multiple sensors with high-performance processors that make control decisions.